Method for manufacturing display panel, display panel, and display apparatus

ABSTRACT

A method for manufacturing a display panel includes providing a backplate, forming bonding parts on backplate, forming an auxiliary layer on backplate, releasing light-emitting elements onto the auxiliary layer such that electrodes of the light-emitting elements are in contact with the first parts to form an intermediate backplate, arranging the intermediate backplate under first predetermined condition under which a fluidity of the first part is greater than that of the second part, and bonding the electrodes and the bonding parts to form an eutectic bonding layer, and arranging the intermediate backplate under second predetermined condition such that the first and second parts form solid-state first and second members. The backplate includes first and second regions. The bonding parts are located in the first regions. The auxiliary layer covers the backplate and the bonding parts. The auxiliary layer includes first and second parts respectively located in the first and second regions.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims priority to Chinese Patent ApplicationNo. 202211319420.7, filed on Oct. 26, 2022, the content of which isincorporated herein by reference in its entirety.

TECHNICAL FIELD

The present disclosure relates to the field of display technologies, andin particular, to a display panel, a method for manufacturing a displaypanel, and a display apparatus.

BACKGROUND

In the manufacturing process of the display panel, light-emittingelements need to be transferred to a backplate through a mass transfertechnology. However, the current transfer accuracy of light-emittingelements is low, which affects the yield of the display panel

SUMMARY

In a first aspect, some embodiments of the present disclosure provide amethod for manufacturing a display panel. The method includes providinga backplate, forming a plurality of bonding parts on the backplate, thebackplate including a plurality of first regions and a second regionsurrounding the plurality of first regions, and the plurality of bondingparts being located in the plurality of first regions, forming anauxiliary layer on the backplate, the auxiliary layer covering thebackplate and the plurality of bonding parts, and the auxiliary layerincluding a plurality of first parts located in the plurality of firstregions and a second part located in the second region, releasing aplurality of light-emitting elements onto the auxiliary layer in such amanner that electrodes of the plurality of light-emitting elements arein contact with the plurality of first parts to form an intermediatebackplate; arranging the intermediate backplate under a firstpredetermined condition under which a fluidity of the plurality of firstparts is greater than a fluidity of the second part; and bonding theelectrodes of the plurality of light-emitting elements and the pluralityof bonding parts to form an eutectic bonding layer, and arranging theintermediate backplate under a second predetermined condition, such thatthe plurality of first parts forms a plurality of solid-state firstmembers and the second part forms a solid-state second member.

In a second aspect, some embodiments of the present disclosure provide adisplay panel. The display panel includes a backplate, a eutecticbonding layer and an auxiliary layer that are located at a side of thebackplate, and a plurality of light-emitting element bodies. Theauxiliary layer includes a plurality of first members and a secondmember. At least one first member of the plurality of first memberssurrounds one part of the eutectic bonding layer, and the second membersurrounds the plurality of first members. Each of the plurality oflight-emitting element bodies is located at a side of the eutecticbonding layer, and is connected to one part of the eutectic bondinglayer.

In a third aspect, some embodiments of the present disclosure provide adisplay apparatus including a display panel. The display panel includesa backplate, a eutectic bonding layer and an auxiliary layer that arelocated at a side of the backplate, and a plurality of light-emittingelement bodies. The auxiliary layer includes a plurality of firstmembers and a second member. At least one first member of the pluralityof first members surrounds one part of the eutectic bonding layer, andthe second member surrounds the plurality of first members. Each of theplurality of light-emitting element bodies is located at a side of theeutectic bonding layer, and is connected to one part of the eutecticbonding layer.

BRIEF DESCRIPTION OF DRAWINGS

In order to more clearly illustrate the embodiments of the presentdisclosure, the accompanying drawings used in the embodiments arebriefly described below. The drawings described below are merely a partof the embodiments of the present disclosure. The accompanying drawingsin the following description are some embodiments of the presentdisclosure, and other accompanying drawings can be obtained inaccordance with these drawings for those skilled in the art.

FIG. 1 is a flowchart of a method for manufacturing a display panelprovided by some embodiments of the present disclosure;

FIG. 2 is a flow diagram showing structures formed in various stagesaccording to a method for manufacturing a display panel provided by someembodiments of the present disclosure;

FIG. 3 is a top view of a backplate provided by some embodiments of thepresent disclosure;

FIG. 4 is a top view of an auxiliary layer before being arranged under afirst predetermined condition provided by some embodiments of thepresent disclosure;

FIG. 5 is a schematic diagram showing layers of a light-emitting elementprovided by some embodiments of the present disclosure;

FIG. 6 is a schematic diagram showing the self-alignment of alight-emitting element provided by some embodiments of the presentdisclosure;

FIG. 7 is another flow diagram showing structures formed in variousstages according to another method for manufacturing a display panelprovided by some embodiments of the present disclosure;

FIG. 8 is a schematic diagram of a first region provided by someembodiments of the present disclosure;

FIG. 9 is another schematic diagram of a first region provided by someembodiments of the present disclosure;

FIG. 10 is yet another schematic diagram of a first region provided bysome embodiments of the present disclosure;

FIG. 11 is yet another schematic diagram of a first region provided bysome embodiments of the present disclosure;

FIG. 12 is yet another schematic diagram of a first region provided bysome embodiments of the present disclosure;

FIG. 13 is yet another schematic diagram of a first region provided bysome embodiments of the present disclosure;

FIG. 14 is another flowchart of a method for manufacturing a displaypanel provided by some embodiments of the present disclosure;

FIG. 15 is another flow diagram showing structures formed in variousstages according to another method for manufacturing a display panelprovided by some embodiments of the present disclosure;

FIG. 16 is another flow diagram showing structures formed in variousstages according to another method for manufacturing a display panelprovided by some embodiments of the present disclosure;

FIG. 17 is yet another flowchart of a method for manufacturing a displaypanel provided by some embodiments of the present disclosure;

FIG. 18 is another flow diagram showing structures formed in variousstages according to a method for manufacturing a display panel providedby some embodiments of the present disclosure;

FIG. 19 is another flow diagram showing structures formed in variousstages according to a method for manufacturing a display panel providedby some embodiments of the present disclosure;

FIG. 20 is another flow diagram showing structures formed in variousstages according to the method for manufacturing a display panelprovided by some embodiments of the present disclosure;

FIG. 21 is a schematic diagram showing an arrangement of a third regionprovided by some embodiments of the present disclosure;

FIG. 22 is another top view of an auxiliary layer before being arrangedunder a first predetermined condition provided by some embodiments ofthe present disclosure;

FIG. 23 is a schematic diagram of a backplate provided by someembodiments of the present disclosure;

FIG. 24 is another flow diagram showing structures formed in variousstages according to the method for manufacturing a display panelprovided by some embodiments of the present disclosure;

FIG. 25 is a schematic diagram of a display panel provided by someembodiments of the present disclosure;

FIG. 26 is another schematic diagram of a display panel provided by someembodiments of the present disclosure;

FIG. 27 is yet another schematic diagram of a display panel provided bysome embodiments of the present disclosure;

FIG. 28 is a partial top view of a display panel provided by someembodiments of the present disclosure;

FIG. 29 is a cross-sectional view along line A1-A2 provided by someembodiments of the present disclosure;

FIG. 30 is another partial top view of a display panel provided by someembodiments of the present disclosure;

FIG. 31 is another partial top view of a display panel provided by someembodiments of the present disclosure;

FIG. 32 is another partial top view of a display panel provided by someembodiments of the present disclosure;

FIG. 33 is another partial top view of a display panel provided by someembodiments of the present disclosure;

FIG. 34 is another partial top view of a display panel provided by someembodiments of the present disclosure;

FIG. 35 is another schematic diagram of a display panel provided by someembodiments of the present disclosure;

FIG. 36 is another schematic diagram of a display panel provided by someembodiments of the present disclosure; and

FIG. 37 is a schematic diagram of a display apparatus provided by someembodiments of the present disclosure.

DESCRIPTION OF EMBODIMENTS

For facilitating the understanding of the technical solution of thepresent disclosure, the embodiments of the present disclosure aredescribed in detail as below.

It should be understood that the embodiments described below are merelysome of, rather than all of the embodiments of the present disclosure.On a basis of the embodiments in this disclosure, all other embodimentsobtained by the ordinary skilled in the art without paying creativeeffort are within a protection scope of this disclosure.

The terms used in the embodiments of the present disclosure are merelyfor the purpose of describing specific embodiments, but not intended tolimit the present disclosure. The singular forms of “a”, “an” and “the”used in the embodiments of the present disclosure and the appendedclaims are also intended to indicate plural forms, unless clearlyindicating others.

It should be understood that the term “and/or” used herein merelyindicates a relationship describing associated objects, indicating threepossible relationships. For example, the expression “A and/or B”indicates: A alone, both A and B, or B alone. The character “/” in thisdescription generally means that the associated objects are in an “or”relationship.

Embodiments of the present disclosure provides a method formanufacturing a display panel. FIG. 1 is a flowchart of a method formanufacturing a display panel provided by some embodiments of thepresent disclosure. FIG. 2 is a flow diagram showing structures formedin various stages according to a method for manufacturing a displaypanel provided by some embodiments of the present disclosure. FIG. 3 isa top view of a backplate 1 provided by some embodiments of the presentdisclosure. FIG. 4 is a top view of an auxiliary layer 5 before beingarranged under a first predetermined condition provided by someembodiments of the present disclosure. As shown in FIG. 1 to FIG. 4 ,the method for manufacturing the display panel includes the steps S1-S6.

At step S1, a backplate 1 is provided.

At step S2, multiple bonding parts 2 are formed on the backplate 1. Thebackplate 1 includes multiple first regions 3 and a second region 4surrounding the first regions 3, and the bonding part 2 is located inthe first region 3.

The bonding part 2 is located in the first region 3. That is, the firstregion 3 covers the boding part 2. For example, the first region 3covers one bonding part 2, the bonding part 2 includes multiple edges.For any one of the multiple edges of the bonding part 2, an edge of thefirst region 3 is parallel to and located outside the edge of thebonding part 2 and is spaced apart from the edge of the bonding part 2with a certain distance. For example, a shape of the bonding part 2 isrectangular, a shape of the first region 3 is also rectangular, and theedge of the first region 3 and the edge of the bonding part 2 covered bythe first region 3 are spaced apart from each other with a certaindistance.

At step S3, an auxiliary layer 5 is formed on the backplate 1. Theauxiliary layer 5 covers the backplate 1 and the bonding parts 2. Theauxiliary layer 5 includes first parts 6 located in the first regions 3and a second part 7 in the second region 4. The first region 3 isdefined by the first part 6.

At step S4, multiple light-emitting elements 8 are released on theauxiliary layer so that electrodes 9 of the light-emitting elements 8are in contact with the first parts 6 to form an intermediate backplate10.

The light-emitting element 8 may be an inorganic light-emitting diode(LED). For example, the light-emitting element 8 may be a miniaturelight-emitting diode, for example, a micro LED or a mini LED. Thelight-emitting elements 8 may be transferred from a source substrate oran intermediate substrate and released to the backplate 1 through themass transfer technology. During releasing, the light-emitting elements8 may be released separately one by one, or the light-emitting elements8 may be released group by group, for example, through stamp transfer.In the stamp transfer, by adjusting a viscosity of a layer in contactwith the light-emitting element, multiple light-emitting elements 8 canbe simultaneously released. For example, the light-emitting elements 8include red light-emitting elements, green light-emitting elements, andblue light-emitting elements. Multiple red light-emitting elements 8 aresimultaneously released on the backplate 1, then multiple greenlight-emitting elements 8 are simultaneously released on the backplate1, and finally, multiple blue light-emitting elements 8 aresimultaneously released on the backplate 1.

At step S5, the intermediate backplate 10 is arranged under a firstpredetermined condition under which a fluidity of the first part isgreater than a fluidity of the second part.

At step S6, the electrodes 9 of the light-emitting elements 8 arerespectively bonded to the bonding parts 2 to form an eutectic bondinglayer 11, and the intermediate backplate 10 is arranged under a secondpredetermined condition, such that the first part 6 forms a solid-statefirst member 12, and the second part 7 forms a solid-state second member13. That is, the final auxiliary layer 5 includes the first member 12and the second member 13.

In some embodiments, the electrode 9 of the light-emitting element 8 andthe bonding part 2 are bonded through a thermocompression bondingtechnique. During the thermocompression bonding technique, the electrode9 of the light-emitting element 8 is pressed so as to be in contact withthe bonding part 2, such that the electrode 9 and the bonding part 2 arebonded to form a eutectic bonding layer 11. For example, the electrode 9of the light-emitting element 8 is made of Au, the bonding part 2 ismade of In, and the eutectic bonding layer 11 formed by bonding the twomay be AuIn compound.

FIG. 5 is a schematic diagram showing layers of a light-emitting elementprovided by some embodiments of the present disclosure. It can beunderstood that, as shown in FIG. 5 , in addition to the electrode 9,the light-emitting element 8 may include an N-type semiconductor 51, aP-type semiconductor 53, and an active layer 52 located between theN-type semiconductor 51 and the P-type semiconductor 53. Electrodes 9 ofthe light-emitting element 8 include an anode 54 and a cathode 55. Theanode 54 is electrically connected to the P-type semiconductor 53. Thecathode 55 is electrically connected to the N-type semiconductor 51.

Before the electrode 9 of the light-emitting element 8 and the bondingpart 2 are bonded to each other, the electrode 9 and the bonding part 2are independent from each other. After the electrode 9 and the bondingpart 2 are bonded to each other, the electrode 9 and the bonding part 2form the eutectic bonding layer 11 through bonding. The part other thanthe electrodes 9 in the light-emitting element 8 may be defined as thelight-emitting element body 21. For example, the light-emitting elementbody 21 may include the N-type semiconductor 51, the P-typesemiconductor 53, and the active layer 52.

In the related art, after the light-emitting elements 8 are releasedfrom the source substrate or the intermediate substrate to the backplate1, the electrode 9 of the light-emitting element 8 is directly bonded tothe bonding part 2. However, if taking influence such as alignmentdeviation into account, the actual releasing position of thelight-emitting element 8 on the backplate 1 may deviate from its presetreleasing area. As a result, the electrode 9 of the light-emittingelement 8 is not aligned with its corresponding bonding part 2, therebyaffecting a connection reliability when the electrode 9 and the bondingpart 2 are bonded.

According to the manufacturing method provided by embodiments of thepresent disclosure, the auxiliary layer 5 is arranged on the backplate1, and the auxiliary layer 5 is used for adjusting the position of thelight-emitting element 8, such that self-alignment of the light-emittingelement 8 can be realized. For example, under the first predeterminedcondition, the fluidity of the first part 6 of the auxiliary layer 5located in the first region 3 is different from the fluidity of thesecond part 7 located in the second region 4, such that when theintermediate backplate 10 is arranged under the first predeterminedcondition, the first part 6 may have a high fluidity, for example, thefirst member 12 may be in a liquid state. FIG. 6 is a schematic diagramshowing the self-alignment of a light-emitting element 8 provided bysome embodiments of the present disclosure. As shown in FIG. 6 , whenthe first part 6 flows, the molecules at its surface layer are subjectedto a tensile force directed to an interior of a material of the firstpart 6 under the action of molecules inside the material and under theaction of gas molecules, such that the surface of the material has atendency to shrink, and the surface tension will act on the electrode 9of the light-emitting element 8 and generate a force F on the electrode9, which in turn causes a slight translation of the light-emittingelement 8, and the light-emitting element 8 is pulled into the presetarea, so that the self-alignment of the light-emitting element 8 isrealized. Meanwhile, the second part 7 has a low fluidity under thefirst predetermined condition, for example, the second part 7 may be ina solid state, so the second part 7 can function as a block layer forblocking the flowing of the first part 6 and strengthening the role ofthe first part 6 on the light-emitting element 8, thereby improving theself-alignment effect of the light-emitting element 8.

Therefore, in embodiments of the present disclosure, the first parts andthe second part of the auxiliary layer 5 are designed to have differentmaterial characteristics under the first predetermined condition. In themanufacturing process of the display panel, the self-alignment of thelight-emitting element 8 can be realized through the surface tension ofthe first part 6, thereby improving the transfer accuracy of thelight-emitting element 8.

In the process of mass transfer, the transfer accuracy of thelight-emitting element 8 is typically associated with the transferefficiency. Due to the influence of temperature on the accuracy of thegalvanometer mirror and the stability of the galvanometer mirror whenthe galvanometer mirror during high-speed scanning, as well as thebottleneck of rapid switching of the position of the carrier of theequipment platform, the transfer accuracy is increased along with thetransfer efficiency being reduced. In embodiments of the presentdisclosure, when the transfer accuracy is increased, the transferefficiency may be increased in a certain extent.

In embodiments of the present disclosure, the first member 12 refers toa solid-state structure of the material of the first part 6 that isfinally presented after the manufacturing process of the display panelis complete, and the second member 13 refers to a solid-state structureof the material of the second part 7 that is finally presented after themanufacturing process of the display panel is complete. It should beunderstood that the morphology of the originally formed first part 6,the morphology of the first part 6 under the first predeterminedcondition, and the morphology of the first member 12 may be different;and the morphology of the originally formed second part 7, themorphology of the second part 7 under the first predetermined condition,and the morphology of the second member 13 may also be different.

FIG. 7 is another flow diagram showing structures formed in variousstages according to another method for manufacturing a display panelprovided by some embodiments of the present disclosure. FIG. 8 is aschematic diagram of a first region 3 provided by some embodiments ofthe present disclosure. In some embodiments, as shown in FIG. 7 and FIG.8 , the backplate 1 includes multiple light-emitting elementpre-arranging regions 14. One light-emitting element 8 is provided inthe light-emitting element pre-arranging region 14. An area of thelight-emitting element pre-arranging region 14 may be equal to an areaof the orthographic projection of the light-emitting element 8 on thebackplate 1. In some embodiments of the present disclosure, the firstregions 3 correspond to the light-emitting element pre-arranging regions14 in one-to-one correspondence.

The light-emitting element pre-arranging region 14 includes multipleedges. For any one edge of the light-emitting element pre-arrangingregion 14, an edge of the first region 3 is parallel to and locatedoutside the edge of the light-emitting element pre-arranging region 14and is spaced apart from the edge of the light-emitting elementpre-arranging region 14 with a certain distance. For example, as shownin FIG. 8 , a shape of the light-emitting element pre-arranging region14 is rectangular, the shape of the first region 3 is also rectangular.

In the above configuration, one first region 3 corresponds to onelight-emitting element 8, that is, one first part 6 corresponds to onelight-emitting element 8. Therefore, when the intermediate backplate 10is arranged under the first predetermined condition, the flowing of onefirst part 6 only acts on the electrode 9 of one light-emitting element8. The surface tension of the first part 6 when the first part 6 isflowing pulls one light-emitting element 8 corresponding to the firstpart 6 to the light-emitting element pre-arranging region 14, such thatthe final position of the light-emitting element 8 and thelight-emitting element pre-arranging region 14 coincides with eachother, thereby improving the transfer accuracy of the light-emittingelement 8.

In some embodiment, as shown in FIG. 8 , the first region 3 covers itscorresponding light-emitting element pre-arranging region 14, and thegeometric center O1 of the first region 3 may coincide with thegeometric center O2 of its corresponding light-emitting elementpre-arranging region 14. In this case, after the auxiliary layer 5 isformed, the geometric center O1 of the first region 3 still coincideswith the geometric center O2 of its corresponding light-emitting elementpre-arranging region 14. The surface tension of the first part 6 has asubstantially uniform effect on the light-emitting element 8 in alldirections, so it is conducive to the self-alignment of thelight-emitting element 8.

FIG. 9 is another schematic diagram of a first region 3 provided by someembodiments of the present disclosure. In some embodiments, as shown inFIG. 2 and FIG. 9 , the first regions 3 correspond to the bonding parts2 in one-to-one correspondence.

The bonding part 2 includes multiple edges. For any one edge of bondingpart 2, an edge of the first region 3 is parallel to and located outsidethe edge of the bonding part 2 and is spaced apart from the edge of thebonding part 2 with a certain distance. For example, as shown in FIG. 9, the shape of the bonding part 2 is rectangular, and the shape of thefirst region 3 is also rectangular.

It can be understood that the electrodes 9 of the light-emitting element8 include an anode and a cathode, one anode corresponds to one bondingpart 2, and one cathode corresponds to another bonding part 2. In theabove configuration, one first region 3 corresponds to one bonding part2, and the flowing of one first part 6 only acts on one anode or onecathode of the light-emitting element when the intermediate backplate 10is arranged under the first predetermined condition. The surface tensionof the first part 6 when the first part 6 is flowing pulls the one anodeor the one cathode corresponding to the first part 6 to be aligned withthe bonding part 2, such that the final position of the light-emittingelement 8 and the light-emitting element pre-arranging region 14coincides with each other.

Based on the above configuration, after the auxiliary layer 5 is formed,two adjacent first bonding parts 2 are spaced apart from each other bythe second part 7. When the intermediate backplate 10 is arranged underthe first predetermined condition, the second part 7 can limit themovement of the positive and cathodes of the light-emitting element 8,and thus it is avoided that the anode of the light-emitting element 8moves to the bonding part 2 that is designed to be in contact with thecathode, or the cathode moves to the bonding part 2 that is designed tobe in contact with the anode, thereby effectively reducing the shortcircuit risk of the positive and cathodes of the light-emitting element8.

In one embodiment, as shown in FIG. 9 , the first region 3 covers itscorresponding bonding part 2, and a geometric center O1 of the firstregion 3 may coincide with a geometric center O3 of its correspondingbonding part 2. In this case, after the auxiliary layer 5 is formed, thegeometric center O1 of the first region 3 also coincide with thegeometric center of the bonding part 2. The surface tension of the firstpart 6 has a substantially uniform effect on the electrode 9 of thelight-emitting element 8 in all directions, so it is more conducive tothe self-alignment of the light-emitting element 8.

In some embodiment, as shown in FIG. 8 and FIG. 9 , the first region 3covers the bonding part 2. For example, the first region 3 covers onebonding part 2 or covers two bonding parts 2 in one light-emittingelement pre-arranging region 14. A distance d between the edge of thefirst region 3 and the edge of the bonding part 2 covered by the firstregion 3 satisfies: 3 μm≤d<30 μm.

As shown in FIG. 8 and FIG. 9 , a distance d between the edge of thefirst region 3 extending in the first direction x and the edge of thebonding part 2 extending in the first direction x is denoted by d1, anda distance d between the edge of the first region 3 extending in thesecond direction y and the edge of the bonding part 2 extending in thesecond direction y is denoted by d2, d1 and d2 satisfy 3 μm≤d1<30 μm and3 μm≤d2<30 μm, and d1 and d2 may be equal or may be different.

Taking into account factors such as process accuracy, the actualarranging position of the bonding part 2 may be slightly offset. Byarranging the minimum distance between the edge of the first region 3and the edge of the bonding part 2 covered by the first region 3 to 3μm, the bonding part 2 is still located within the first region 3 evenif the bonding part 2 is slightly offset, such that the first part 6 cancover the bonding part 2 when the auxiliary layer 5 is formed. Byarranging the maximum distance between the edge of the first region 3and the edge of the bonding part 2 covered by the first region 3 to 30μm, it is avoided that the area of the first region 3 is too large, andthe effect of the flowing of the first part 6 to the light-emittingelement 8 is enhanced.

In some embodiments, as shown in FIG. 8 and FIG. 9 , the shape of thefirst region 3 may be a rectangle. FIG. 10 is yet another schematicdiagram of a first region 3 provided by some embodiments of the presentdisclosure. FIG. 11 is yet another schematic diagram of a first region 3provided by some embodiments of the present disclosure. In someembodiments, as shown in FIG. 10 and FIG. 11 , the shape of the firstregion 3 may be a rounded rectangle. FIG. 12 is yet another schematicdiagram of a first region 3 provided by some embodiments of the presentdisclosure. FIG. 13 is yet another schematic diagram of a first region 3provided by some embodiments of the present disclosure. In someembodiments, as shown in FIG. 12 and

FIG. 13 , the shape of the first region 3 may be a circle or oval.

In the above configuration, the first region 3 has a regular shape. Whenthe first part 6 flows, the surface tension of the first part 6 has asubstantially uniform the degree of effect on the light-emitting element8 in all directions, so it is more conducive to the self-alignment ofthe light-emitting element 8.

In some embodiments, when one first region 3 corresponds to onelight-emitting element pre-arranging region 14, as shown in FIG. 8 , ifthe first region 3 has a rectangle shape, a long side of the firstregion 3 is parallel to a long side of the light-emitting elementpre-arranging region 14. As shown in FIG. 12 , if the first region 3 hasan oval shape, a long diameter of the first region 3 is parallel to thelong side of the light-emitting element pre-arranging region 14. In thisway, it is avoided that the first region 3 occupies a large space in thedirection of the short side of the light-emitting element pre-arrangingregion 14, and the position of the first region 3 is more reasonable.

When one first region 3 corresponds to one bonding part 2, as shown inFIG. 9 , if the first region 3 has a rectangle shape, a long side of thefirst region 3 is parallel to a long side of the bonding part 2. Asshown in FIG. 13 , if the first region 3 has an oval shape, a longdiameter of the first region 3 is parallel to the long side of thebonding part 2. In this way, it is avoided that the first region 3occupies a large space in the direction of the short side of the bondingpart 2, and the position of the first region 3 is more reasonable.

FIG. 14 is a flowchart of another method for manufacturing a displaypanel provided by some embodiments of the present disclosure. FIG. 15 isanother flow diagram showing structures in various stages of anothermethod for manufacturing a display panel provided by some embodiments ofthe present disclosure. In some embodiments of the present disclosure,as shown in FIG. 14 and FIG. 15 , the step S3 may include steps S31 andS32.

At step S31, a photoresist 15 is formed on the backplate 1 by coating,and the photoresist 15 covers the backplate 1 and the bonding parts 2.

At step S32, the photoresist in the first regions 3 is not exposed, andthe first part 6 is formed by the unexposed photoresist (for clarity,the unexposed photoresist is denoted by 15_1 in the drawings); and thephotoresist in the second region 4 is exposed, and the second part 7 isformed by the exposed photoresist (for clarity, the exposed photoresistis denoted by 15_2 in the drawings).

The light shown at step S32 in FIG. 15 represents the light that haspassed through the mask. During exposing, the mask is placed above thephotoresist 15. The light has a same intensity at all positions beforepassing through the mask. The mask only allows the light correspondingto the second region 4 to pass through, such that only the photoresist15 in the second region 14 are exposed.

In some embodiments, the process of arranging the intermediate backplate10 under the first predetermined condition includes: heating theintermediate backplate 10 to a first predetermined temperature range,where in the first predetermined temperature range, the viscosity of theunexposed photoresist 15_1 is smaller than the viscosity of the exposedphotoresist 15_2.

The process of arranging the intermediate backplate 10 under the secondpredetermined condition includes: heating the intermediate backplate 10to a second predetermined temperature range, where in the secondpredetermined temperature range, the unexposed photoresist 15_1 is in asolid state and forms the first member 12, and the exposed photoresist15_2 is in a solid state and forms the second member 13.

In the above configurations, both the first part 6 and the second part 7are made of the photoresist material. The photoresist has a certainviscosity. The unexposed photoresist does not undergo crosslink reactionand does not harden. Within a certain temperature range, the viscosityof the photoresist decreases as the increasing of the temperature, andthus the fluidity of the photoresist increases. The exposed photoresisthardens due to the crosslink reaction, and remains in the harden stateafter being heated. The exposed photoresist has a very small fluidity oreven does not flow. In this way, the fluidity of the first part 6 andthe fluidity of the second part 7 satisfy the design requirements.

In some embodiments, the first part 6 and the second part 7 are made ofthe same material. When coating, on the backplate 1, the photoresistcovering the backplate 1 and the bonding part 2, the upper surface ofthe entire photoresist layer on the side away from the backplate 1 isplanar, such that the fluctuation of the upper surface of the first part6 and the upper surface of the second part 7 can be reduced. When thelight-emitting element 8 is released onto the auxiliary layer 5, theplacement stability of the light-emitting element 8 can be improved,avoiding incline of the light-emitting element 8.

It can be understood that, in embodiments of the present disclosure, theelectrode 9 of the light-emitting element 8 and the bonding part 2 arebonded through a thermal compression bonding process. Since the thermalcompression bonding process needs high temperature, the process ofheating the intermediate backplate 10 to the second predeterminedtemperature range may be performed synchronously with the thermalcompression bonding process. That is, the process of bonding theelectrode 9 of the light-emitting element 8 and the bonding part 2 cancause the intermediate backplate 10 within the second predeterminedtemperature range. In this way, the unexposed photoresist is in a solidstate and forms the first member 12, and the exposed photoresist is in asolid state and forms the second member 13.

It can be understood that when exposing the photoresist in the secondregion 4, the light source irradiates this part of the photoresist fromtop to bottom (in a direction from the auxiliary layer 5 to thebackplate 1), so the crosslinking reaction of the photoresist in thesecond region 4 in the exposing process is from top to bottom. When theintermediate backplate 10 is heated to the second predeterminedtemperature range, the crosslinking reaction of the photoresist in thefirst region 3 is from bottom to top (in a direction from the backplate1 to the auxiliary layer 5). If the photoresist in the first region 3and the photoresist in the second region 4 are not completely reacted inthe crosslinking reaction, the formed first member 12 and second member13 may be different in composition.

In some embodiments, the first predetermined temperature range has aminimum temperature value of 80° C. and a maximum temperature value of120° C., and a minimum temperature value of the second predeterminedtemperature range is 150° C.

The unexposed photoresist has a high fluidity when being heated to 80°C. to 120° C., and its fluidity satisfies the requirement. The unexposedphotoresist is cured when being heated to a temperature above 150° C.,and forms the first member 12, such that the eutectic bonding layer 11is fixed to the position.

In some embodiments, when coating the photoresist on the backplate 1, atemperature for coating the second region 4 is smaller than atemperature for coating the first region 3.

By controlling the temperature for coating the first region 3 and thetemperature for coating the second region 4, the thickness of thephotoresist in the first region 3 and the thickness of the photoresistin the second region 4 can be adjusted. FIG. 16 is another flow diagramshowing structures in various stages of another method for manufacturinga display panel provided by some embodiments of the present disclosure.In some embodiments, as shown in FIG. 16 , the thickness of thephotoresist in the second region 4 can be increased by decreasing thetemperature of the temperature for coating the second region 4, suchthat the upper surface of the photoresist (the second part 7) in thesecond region 4 on the side opposite to the backplate 1 is higher thanthe upper surface of the photoresist (the first part 6) in the firstregion 3 on the side opposite to the backplate 1, which can reduce theoverflow risk when the photoresist (the first part 6) in the firstregion 3 flows in the subsequent process step.

FIG. 17 is yet another flowchart of a method for manufacturing a displaypanel provided by some embodiments of the present disclosure. FIG. 18 isanother flow diagram showing structures in various stages of the methodfor manufacturing a display panel provided by some embodiments of thepresent disclosure. In some embodiments, as shown in FIG. 17 and FIG. 18, the step S3 may include steps S31′ and S32′.

At step S31′, a first colloid 16 is formed in the first region 3, andthe first part 6 is formed through the first colloid 16.

At step S32′, a second colloid 17 is formed in the second region 4, andthe second part 7 is formed through the second colloid 17.

Based on the above, the process of arranging the intermediate backplate10 under the first predetermined condition includes: applying anexternal force to the intermediate backplate 10. When the external forceis applied to the intermediate backplate 10, a thixotropy of the firstcolloid 16 is greater than a thixotropy of the second colloid 17.

The process of arranging the intermediate backplate 10 under the firstpredetermined condition includes: stopping applying the external forceto the intermediate backplate 10, and letting the intermediate backplate10 to stand. The first colloid 16 is in a solid state and forms thefirst member 12, and the second colloid 17 is in a solid state and formsthe second member 13.

The first colloid 16 may be a high-thixotropy epoxy series colloid, andthe second colloid 17 may be a low-thixotropy epoxy series colloid.

The first colloid 16 and the second colloid 17 become sols with certainfluidity under the action of external force. After standing for a periodof time, the first colloid 16 and the second colloid 17 gradually returnto the original gel state. When the external force is applied, thethixotropy of the first colloid 16 is larger, so the fluidity of thefirst colloid 16 is higher, and then the flowing of the first colloid 16can be used to realize the self-alignment of the light-emitting element8.

It can be understood that the first colloid 16 and the second colloid 17may be formed by different patterning processes, so the upper surface ofthe first colloid 16 on the side opposite to the backplate 1 and theupper surface of the second colloid 17 on the side opposite to thebackplate 1 may not be at the same level. FIG. 19 is another flowdiagram showing structures in various stages of the method formanufacturing a display panel provided by some embodiments of thepresent disclosure. For example, as shown in FIG. 19 , the upper surfaceof the second colloid 17 on the side opposite to the backplate 1 ishigher than the upper surface of the first colloid 16 on the sideopposite to the backplate 1, such that the overflow risk due to theflowing of the first colloid 16 is reduced when the intermediatebackplate 10 is subsequently placed under an external force condition.

It should be noted that when the electrode 9 of the light-emittingelement 8 and the bonding part 2 are bonded through the thermalcompression bonding process, it does not need to shake the intermediatebackplate 10, so the standing process of the intermediate backplate 10and the thermal compression bonding process may be synchronouslyperformed. That is, the process of bonding the electrode 9 of thelight-emitting element 8 and the bonding part 2 enables the intermediatebackplate 10 to stand. Accordingly, the first colloid 16 is in the solidstate and forms the first member 12, and the second colloid 17 is in thesolid state and forms the second member 13.

FIG. 20 is another flow diagram showing structures in various stages ofthe method for manufacturing a display panel provided by someembodiments of the present disclosure. FIG. 21 is a schematic diagramshowing an arrangement of a third region 18 provided by some embodimentsof the present disclosure. FIG. 22 is another top view of an auxiliarylayer 5 before being arranged under a first predetermined conditionprovided by some embodiments of the present disclosure. In someembodiments, as shown in FIG. 20 to FIG. 22 , the backplate 1 includesmultiple third regions 18. The third region 18 surrounds one firstregion 3, and is located between the first region 3 and the secondregion 4.

When forming the auxiliary layer 5, the auxiliary layer 5 includesmultiple third parts 19, each of which is located in one third region18. Under the first predetermined condition, the fluidity of the thirdpart 19 is smaller than the fluidity of the first part 6, and is greaterthan the fluidity of the second part 7.

When the intermediate backplate 10 is arranged under the secondpredetermined condition, the third part 19 forms a solid third member20.

When the backplate 10 is arranged under the first predeterminedcondition, the fluidity of the third part 19 is between the fluidity ofthe first part 6 and the fluidity of the second part 7. The third part19 may act as a transitional buffer for the flowing of the first part 6,and weakens the blocking force applied by the second part 7 to the firstpart 6, thereby weakening the effect of this force on the flowing of thefirst part 6.

In some embodiments, under the first predetermined condition, the firstpart 6 is in a liquid state, and the second part 7 is in a solid state.In this case, under the first predetermined condition, the first part 6has a higher fluidity, and a greater surface tension, and thus canbetter drive the light-emitting element 8 to realize the self-alignment.Meanwhile, the second part 7 is in a solid state and does not flow, andthus can more effectively blocking the flowing of the first part 6,thereby strengthening the act of the flowing of the first part 6 on thelight-emitting element 8.

In some embodiments, as shown in FIG. 18 , when forming the auxiliarylayer 5, the upper surface of the first part 6 on the side opposite tothe backplate 1 and the upper surface of the second part 7 on the sideopposite to the backplate 1 are at the same level. With sucharrangement, when the light-emitting element 8 is released onto theauxiliary layer 5 in the subsequent process step, the stability of thelight-emitting element 8 is improved, and incline is avoided.

In some embodiments, as shown in FIG. 16 and FIG. 19 , when forming theauxiliary layer 5, a distance between the backplate 1 and an uppersurface of the first part 6 away from the backplate 1 is smaller than adistance between the backplate 1 and an upper surface of the second part7 away from the backplate 1. With such configuration, the upper surfaceof the second part 7 is higher than the upper surface of the first part6. As a result, when the first part 6 flows in the subsequent processstep, the overflow risk of the first part 6 can be reduced.

It can be understood that combined with the foregoing contents, in someembodiments, both the first part 6 and the second part 7 arephotoresists. When coating the photoresist on the backplate 1, thetemperature for coating the first region 3 and the temperature forcoating the second region 4 are arranged to be different, such that theupper surface of the second part 7 is higher than the upper surface ofthe first part 6. In another embodiment, the first part 6 is the firstcolloid 16, the second part 7 is the second colloid 17, and the firstcolloid 16 and the second part 17 may be formed by different patterningprocesses, such that the upper surface of the second part 7 is higherthan the upper surface of the first part 6.

FIG. 23 is a schematic diagram of a backplate provided by someembodiments of the present disclosure. FIG. 24 is another flow diagramshowing structures in various stages of the method for manufacturing adisplay panel provided by some embodiments of the present disclosure. Itcan be understood that, as shown in FIG. 23 and FIG. 24 , the backplate1 includes a substrate 60, a circuit layer 61, and a backplate electrode23. The circuit layer 61 includes: a buffer layer 63, a semiconductorlayer 64, a gate insulation layer 65, a first metal layer 66, a firstinterlayer insulation layer 67, a second metal layer 68, and aflattening layer 69 that are stacked on the substrate 60. Thesemiconductor layer 64 is used for forming structures such as an activelayer p of the transistor 70. The first metal layer 66 is used to formstructures such as the gate g of the transistor 70. The second metallayer 68 is used to form structures such as the first electrode s andthe second electrode d of the transistor 70, and a negative power supplysignal line 71.

The backplate electrode 23 is located at a side of the circuit layer 61away from the substrate 60. In some embodiments, the backplate electrode23 includes a first backplate electrode 72 and a second backplateelectrode 73. The first backplate electrode 72 is electrically connectedto the second electrode d of the transistor 70, and is configured toreceive a driving voltage transmitted by the transistor 70. The secondbackplate electrode 73 is electrically connected to the negative powersupply signal line 71, and is configured to receive a negative powersupply voltage transmitted by the negative power supply signal line 71.

When forming the bonding part 2, the bonding part 2 is located at a sideof the backplate electrode 23 and is in contact with the backplateelectrode 23. The first region 3 may cover the backplate electrode 23,such that the subsequently formed first part 6 has a large volume,thereby increasing the act of the flowing of the first part 6 to thelight-emitting element 8.

Some embodiments of the present disclosure provide a display panel. Thedisplay panel may be manufactured through the above method. FIG. 25 is aschematic diagram of a display panel provided by some embodiments of thepresent disclosure. As shown in FIG. 2 and FIG. 25 , the display panelincludes a backplate 1, an eutectic bonding layer 11 and an auxiliarylayer 5 that are located at a side of the backplate 1, and alight-emitting element body 21 located at a side of the eutectic bondinglayer 11.

The auxiliary layer 5 includes a first member 12 and a second member 13.At least part of the first member 12 surrounds the eutectic bondinglayer 11, and the second member 13 surrounds the first member 12. Thelight-emitting element body 21 is connected to the eutectic bondinglayer 11. The light-emitting element body 21 includes an epitaxiallayer, a hole injection layer, an electron injection layer, a holetransport layer, an electron transport layer, a light-emitting layer,and the like.

Combined with the above description of the method for manufacturing thedisplay panel, in the process of manufacturing the display panel, whenforming the auxiliary layer 5, the first part 6 is formed in the firstregion 3, and then the first member 12 is formed through the first part6; and the second part 6 is formed in the second region 4, and then thesecond member 13 is formed through the second part 7. Since the fluidityof the material of the first member 12 is high under the firstpredetermined condition, when the first member 12 flows, the surfacetension of the material of the first member 12 causes a slighttranslation of the light-emitting element 8. In this way, thelight-emitting element 8 is pulled to the preset area, and thus theself-alignment of the light-emitting element 8 is realized, therebyimproving the transfer accuracy.

In some embodiments, as shown in FIG. 26 and FIG. 27 , a maximumdistance between the backplate 1 and the upper surface of the firstmember 12 away from the backplate 1 is l1, a maximum distance betweenthe backplate 1 and the upper surface of the second member 13 away fromthe backplate 1 is l2, and l1≠l2. Since the first part 6 flows duringthe manufacturing process of the display panel, the morphology of thefirst part 6 changes. As a result, when the first part 6 is cured toform the first member 12 in the subsequent step, the upper surface ofthe first member 12 and the upper surface of the second member 13 arenot at the same level.

FIG. 26 is another schematic diagram of a display panel provided by someembodiments of the present disclosure. In some embodiments, as shown inFIG. 26 , the first member 12 includes a surrounding portion 24 and anoverflow portion 25. The surrounding portion 24 surrounds the eutecticbonding layer 11, the second member 13 surrounds the surrounding portion24, the overflow portion 25 and the surrounding portion 24 arecommunicated with each other, and the overflow portion 25 is located ata side of the second member 13 away from the backplate 1. In this case,l1>l2.

Combined with the above description, both the first member 12 and thesecond member 13 may be made of photoresist. In this case, the materialof the first member 12 and the material of the second member 13 aresimultaneously coated on the backplate 1. By smoothing the surface ofthe coated photoresist, the upper surface of the first part 6 and theupper surface of the second part 7 have a small fluctuation. In thiscase, when the first part 6 is finally cured to form the first member12, part of material may overflow and form the overflow portion 25. Inthis structure, the initially formed first part 6 have a large height,and the first part 6 can provide a greater force on the light-emittingelement 8 when flowing, thereby increasing the intensity of action andimproving the self-alignment of the light-emitting element 8.

FIG. 27 is yet another schematic diagram of a display panel provided bysome embodiments of the present disclosure. In some embodiments, asshown in FIG. 27 , the first member 12 surrounds the eutectic bondinglayer 11, the second member 13 surrounds the first member 12, and l1<l2.

Combined with the above description, in some embodiments, both the firstmember 12 and the second member 13 are made of photoresist. When coatingthe photoresist on the backplate 1, the temperature for coating thefirst region 3 is different from the temperature for coating the secondregion 4, such that the upper surface of the second member 13 is higherthan the upper surface of the first member 12. In some embodiments, thematerial of the first member 12 is the first colloid 16, the material ofthe second member 13 is the second colloid 17, and the first colloid 16and the second colloid 17 are formed by different patterning processes,such that the upper surface of the second member 13 is higher than theupper surface of the first member 12. In this structure, the height ofthe initially formed first part 6 is small, and overflow is avoided whenflowing or being cured.

FIG. 28 is a partial top view of a display panel provided by someembodiments of the present disclosure. FIG. 29 is a cross-sectional viewalong line A1-A2 provided by some embodiments of the present disclosure.In some embodiments, as shown in FIG. 28 and FIG. 29 , the second member13 includes multiple hollows 22, and the hollows 22 correspond to thelight-emitting element bodies 21 in one-to-one correspondence. At leasta part of the first member 12 is located in the hollow 22, and theeutectic bonding layer 11 connected to the light-emitting element body21 is located in the hollow 22 corresponding to the light-emittingelement body 21.

In this structure, one first member 12 corresponds to one light-emittingelement 8, the hollow 22 of the second member 13 has a large area, andthe first member 12 may surrounds two eutectic bonding layers 11corresponding to the light-emitting element 8 at the same time. In themanufacturing process of the display panel, as shown in FIG. 7 , whenthe temporary backplate 10 is arranged under the first predeterminedcondition, the flowing of one first part 6 only acts on the electrode 9of one light-emitting element 8. The surface tension of the first part 6when flowing will be more conducive to pulling the correspondinglight-emitting element 8 into the light-emitting element pre-arrangingregion 14, such that the final position of the light-emitting element 8coincides with the light-emitting element pre-arranging region 14, andthe transfer accuracy of the light-emitting element 8 is improved.

FIG. 30 is another partial top view of a display panel provided by someembodiments of the present disclosure. In some embodiments, as shown inFIG. 30 , the second member 13 includes multiple hollows 22, and thehollows 22 correspond to multiple parts of eutectic bonding layers 11 inone-to-one correspondence. At least a part of the first member 12 islocated in the hollow 22, and one of part of the eutectic bonding layer11 is located in the hollow 22 corresponding to this part pf theeutectic bonding layer 11.

In this structure, one first member 12 corresponds to one part of theeutectic bonding layer 11, and the hollow 22 of the second member 13 hasa small surrounding area. in the manufacturing process of the displaypanel, as shown in FIG. 2 , when the temporary backplate 10 is arrangedunder the first predetermined condition, the flowing of one first part 6only acts on one cathode or one anode of the light-emitting element 8.The surface tension of the first part 6 when flowing will be moreconducive to making the corresponding one cathode or one anode bealigned with the boding part 2, such that the final position of thelight-emitting element 8 coincides with the light-emitting elementpre-arranging region 14. Moreover, the second part 7 can limit themovement of the positive and cathodes of the light-emitting element 8.In this way, it is avoided that the anode of the light-emitting element8 moves to the bonding part 2 that is designed to be in contact with thecathode, and is avoided that the cathode moves to the bonding part 2that is designed to be in contact with the anode, thereby effectivelyreducing the short circuit risk of the positive and cathodes of thelight-emitting element 8.

In some embodiments, as shown in FIG. 28 to FIG. 34 , the second member34 has multiple hollows 22, and at least a part of the first member 12is located in the hollow 22.

Referring to FIG. 28 and FIG. 30 again, the shape of the hollow 22 maybe rectangle. FIG. 31 is another partial top view of a display panelprovided by some embodiments of the present disclosure. FIG. 32 isanother partial top view of a display panel provided by some embodimentsof the present disclosure. In another embodiment, as shown in FIG. 31and FIG. 32 , the shape of the hollow 22 may be a rounded rectangle.FIG. 33 is another partial top view of a display panel provided by someembodiments of the present disclosure. FIG. 34 is another partial topview of a display panel provided by some embodiments of the presentdisclosure. In yet another embodiment, as shown in FIG. 33 and FIG. 34 ,the shape of the hollow 22 may be round or oval.

In the above structures, the hollow 22 of the second member 13 has aregular shape, and it indicates that the structure in the first part 6is also regular when forming the auxiliary layer 5. As a result, whenthe first part 6 flows, the surface tension of the first part 6 has asubstantially uniform effect on the light-emitting element 8 in alldirections, so it is more conducive to the self-alignment of thelight-emitting element 8.

In some embodiments, as shown in FIG. 25 , a thickness d1 of theeutectic bonding layer 11 in a direction perpendicular to the plane ofthe backplate 1 is greater than a thickness d2 of the second member 13in the direction perpendicular to the plane of the backplate 1.

It can be understood that, as shown in FIG. 2 , after the thermalcompression bonding process, the electrode 9 of the light-emittingelement 8 and the bonding part 2 form the eutectic bonding layer 11, andthe thickness of the eutectic bonding layer 11 is smaller than a sum ofthe thickness of the electrode 9 of the light-emitting element 8 and thethickness of the bonding part 2 before the thermal compression bondingprocess. For example, the thickness of the electrode 9 of thelight-emitting element 8 is 2 μm, the thickness of the bonding part 2 is3 μm, and the thickness of the eutectic bonding layer 11 after thebonding process is 4 μm. It can be understood that the greater thethickness of the eutectic bonding layer 11, the greater the sum of thethickness of the electrode 9 of the light-emitting element 8 and thethickness of the bonding part 2 before the thermal compression bonding.That is, if the thickness of the eutectic bonding layer 11 is greaterthan the thickness of the second member 13, the sum of the thickness ofthe electrode 9 of the light-emitting element 8 and the thickness of thebonding part 2 before the thermal compression bonding is greater thanthe thickness of the second member 13.

Based on the above structure, in the process of manufacturing thedisplay panel, when the intermediate backplate 10 is arranged under thefirst predetermined condition, the material of the first part 6 has ahigh fluidity, and may overflows to the upper surface of the second part7. By setting the total thickness of the bonding part 2 and theelectrode 9 electrically connected to the bonding part 2 greater, thereis a space between the upper surface of the second member 13 and thelight-emitting element body 21 when the first part 6 and the second part7 are cured to form the first member 12 and the second member 13. Thisspace can receive the overflow part of the first member 12. In this way,it is avoided that this overflow part of the first member 12 jacks upthe light-emitting element body 21, and thus it is avoided that thejacking up affects the stability of the light-emitting element body 21.

FIG. 35 is another schematic diagram of a display panel provided by someembodiments of the present disclosure. In some embodiments, as shown inFIG. 35 , the backplate 1 includes a backplate electrode 23. Theeutectic bonding layer 11 is located between the backplate electrode 23and the light-emitting element body 21. The backplate 1 is in contactwith the eutectic bonding layer 11. A thickness d2 of the second member13 in the direction perpendicular to the plane of the backplate 1 isgreater than a thickness d3 of the backplate 23 in the directionperpendicular to the plane of the backplate 1.

Based on the above structure, as shown in FIG. 24 , when forming theauxiliary layer 5, the second part 7 is higher than the backplateelectrode 23, and the second part 7 can block the electrode of thelight-emitting element 8. In this way, when the display panel issubjected to an external force, the risk of inclining of thelight-emitting element 8 can be reduced. Under the first predeterminedcondition, the second part 7 can also block the flowing of the firstpart 6, thereby enhancing the effect of the flowing of the first part 6on the light-emitting element 8.

In some embodiments, under the first predetermined condition, thefluidity of the material of the first member 12 is greater than thefluidity of the material of the second member 13.

Combined with the description of the manufacturing method of the displaypanel, when the intermediate backplate 10 is arranged under the firstpredetermined condition, the first part 6 has a high fluidity, thesurface tension of the first part 6 causes a slight translation of thelight-emitting element 8. In this way, the light-emitting element 8 ispulled to the preset area, and thus the self-alignment of thelight-emitting element 8 is realized, thereby improving the transferaccuracy.

In some embodiments, the first predetermined condition includes: heatingto the first predetermined temperature range. Under the firstpredetermined condition, the viscosity of the material of the firstmember 12 is smaller than the viscosity of the material of the secondmember 13.

The viscosity characterizes the fluidity of the material. The smallerthe viscosity, the higher the fluidity. In the first predeterminedtemperature range, the viscosity of the material of the first member 12is small, indicating that it has high fluidity, which can meet thefluidity requirement.

In some embodiments, within the first predetermined temperature range,if the temperature rises by ΔT, the viscosity of the material of thefirst member 12 deceases by Δη1, the viscosity of the material of thesecond member 13 deceases by Δη2, and Δη1>Δη2.

When the temperature rises by ΔT, the decreasing amount of the viscosityof the material of the first member 12 is greater than the decreasingamount of the viscosity of the material of the second member 13, suchthat the viscosity of the material of the first member 12 is smallerthan that of the material of the second member 13. That is, the materialof the first member 12 has a higher fluidity. In this way, in theprocess of manufacturing the display panel, the self-alignment of thelight-emitting element 8 can be better achieved by utilizing thefluidity of the material of the first part 6.

In some embodiments, within the first predetermined temperature range,as the temperature increases, the acceleration of the decreasing rate ofthe viscosity of the material of the first member 12 is greater than 0.

That is, as the temperature rises, the decreasing rate of the viscosityof the material of the first member 12 increases. As a result, thefluidity requirements of the first part 6 can be met at a slightly lowertemperature, reducing the requirement for the first predeterminedtemperature range.

In some embodiments, within the first predetermined temperature range,as the temperature rises, the acceleration of the decreasing rate of theviscosity of the material of the second member 13 is greater than 0, andthe acceleration of the decreasing rate of the viscosity of the materialof the second member 13 is smaller than the acceleration of thedecreasing rate of the viscosity of the material of the first member 12.In some embodiments, the acceleration of the decreasing rate of theviscosity of the material of the second member 13 is 0. In someembodiments, the acceleration of the decreasing rate of the viscosity ofthe material of the second member 13 is smaller than 0.

When the material of the second member 13 has the above characteristics,as the temperature rises, with satisfying the fluidity requirement ofthe material of the first member 12, the material of the second member13 may have lower fluidity. As a result, in the manufacturing process ofthe display panel, the second part 7 can better block the flowing of thefirst part 6, strengthening the effect of the flowing of the first part6 on the light-emitting element 8.

In some embodiments, the first predetermined condition includes applyingan external force. When the external force is applied, the thixotropy ofthe material of the first member 12 is greater than the thixotropy ofthe material of the second member 13.

Thixotropy characterizes the ability of the fluid to restore itsoriginal structure after the structure is changed under the action ofshear force. When the material is subjected to external force, thegreater the thixotropy, the greater the affecting degree of the fluidityof the material by the external force. When an external force isapplied, the thixotropy of the material of the first member 12 is large,indicating that it has high fluidity, and thus the material of the firstmember 12 can meet the fluidity requirement.

In some embodiments, the first member 12 includes: acrylic adhesive, nonconductive paste (NCP), non conductive film (NCF) or unexposedphotoresist, and the second member 13 includes exposed photoresist.

In some embodiments, the first member 12 includes unexposed photoresist,and the second member 13 includes exposed photoresist. That is, thefirst member 12 and the second member 13 are made of the same material.In another embodiment, the first member 12 includes acrylic adhesive,NCP, or NCF; and the second member 13 includes exposed photoresist. Thatis, the first member 12 and the second member 13 are made of differentmaterials.

When the first member 12 and/or the second member 13 includes thephotoresist, the photoresist has a viscosity. When the photoresist isnot exposed, the photoresist does not harden since no crosslinkingreaction occurs. Within a certain temperature range, the viscosity ofthe photoresist decreases as the temperature increases, and accordinglythe heated photoresist has a higher viscosity. After being exposed, thephotoresist hardens due to the crosslinking reaction, and is kept in acured state after being heated, such that the photoresist has a very lowfluidity. The acrylic adhesive, NCP, and NCF all have a certainviscoelasticity. When the first member 12 includes acrylic adhesive,NCP, or NCF, after the first member 12 is heated, the viscosity of thefirst member 12 decreases, the fluidity of the first member 12increases, and thus the fluidity requirement for the first member 12 canalso be satisfied.

FIG. 36 is another schematic diagram of a display panel provided by someembodiments of the present disclosure. In some embodiments, as shown inFIG. 36 , the auxiliary layer 5 includes multiple third members 20. Eachthird member 20 surrounds one first member 12, and is located betweenthe first member 12 and the second member 13. Under the firstpredetermined condition, the fluidity of the material of the thirdmember 20 is smaller than the fluidity of the material of the firstmember 12, and is greater than the fluidity of the material of thesecond member 13.

Correspondingly, as shown in FIG. 20 , in the manufacturing process ofthe display panel, it needs to define third regions 18 for surroundingthe first regions 3 respectively. When forming the auxiliary layer 5,the auxiliary layer 5 includes third parts 19 located in the thirdregions 18 respectively. When the intermediate backplate 10 is arrangedunder the first predetermined condition, the fluidity of the material ofthe third part 19 is between the fluidity of the first part 6 and thefluidity of the second part 7. The third part 19 may act as atransitional buffer for the flowing of the first part 6, weakens theblocking force applied by the second part 7 to the first part 6, therebyweakening the effect of this force on the flowing of the first part 6.

Some embodiments of the present disclosure provide a display apparatus,and FIG. 37 is a schematic diagram of a display apparatus provided bysome embodiments of the present disclosure. As shown in FIG. 37 , thedisplay apparatus includes a display panel 100 provided by anyembodiment of the present disclosure. The structure of the display panel100 has been described in the above embodiments and will not be repeatedherein. The display apparatus provided by some embodiments of thepresent disclosure can be any electronic device with a display function,such as a mobile phone, a tablet computer, a notebook computer, ane-book, or a television.

The above are merely exemplary embodiments of the present disclosure andare not intended to limit the present disclosure. Any modifications,equivalents, improvements, etc., which are made within the principles ofthe present disclosure, should fall into the scope of the presentdisclosure.

Finally, it can be understood that the above embodiments are only usedto illustrate, rather to limit, the technical solution of the presentdisclosure. Although the present disclosure is described in details withreference to the above embodiments, it should be understood by thoseskilled in the art that they can still modify the technical solutionrecorded in the above embodiments, or to make equivalent replacement tosome or all of the technical features thereof; and these modificationsor replacements do not make the essence of the corresponding technicalsolution deviate from the scope of the technical solutions of allembodiments of the present disclosure.

What is claimed is:
 1. A method for manufacturing a display panel,comprising: providing a backplate; forming a plurality of bonding partson the backplate, the backplate comprising a plurality of first regionsand a second region surrounding the plurality of first regions, and theplurality of bonding parts being located in the plurality of firstregions; forming an auxiliary layer on the backplate, the auxiliarylayer covering the backplate and the plurality of bonding parts, and theauxiliary layer comprising a plurality of first parts located in theplurality of first regions and a second part located in the secondregion; releasing a plurality of light-emitting elements onto theauxiliary layer in such a manner that electrodes of the plurality oflight-emitting elements are in contact with the plurality of first partsto form an intermediate backplate; arranging the intermediate backplateunder a first predetermined condition, wherein under the firstpredetermined condition, the plurality of first parts is in a liquidstate, and the second part is in a solid state; bonding the electrodesof the plurality of light-emitting elements and the plurality of bondingparts to form a eutectic bonding layer; and arranging the intermediatebackplate under a second predetermined condition in such a manner thatthe plurality of first parts forms a plurality of solid-state firstmembers and the second part forms a solid-state second member.
 2. Themethod according to claim 1, wherein the backplate comprises a pluralityof light-emitting element pre-arranging regions, one of the plurality oflight-emitting elements is provided in one of the plurality oflight-emitting element pre-arranging regions, and wherein the pluralityof first regions corresponds to the plurality of light-emitting elementpre-arranging regions in one-to-one correspondence; or wherein theplurality of first regions corresponds to the plurality of bonding partsin one-to-one correspondence.
 3. The method according to claim 1,wherein the plurality of first regions covers the plurality of bondingparts, and a distance d between an edge of one first region of theplurality of first regions and an edge of one bonding part of theplurality of bonding parts corresponding to the one first regionsatisfy: 3 μm≤d<30 μm.
 4. The method according to claim 1, wherein oneof the plurality of first regions has a rectangle shape, a roundedrectangle shape, a circle shape, or an oval shape.
 5. The methodaccording to claim 1, wherein said forming the auxiliary layercomprises: coating a photoresist on the backplate, the photoresistcovering the backplate and the plurality of bonding parts; and notexposing photoresist in the plurality of first regions, and forming theplurality of first parts by utilizing the unexposed photoresist; andexposing photoresist in the second region, and forming the second partby utilizing the exposed photoresist; wherein said arranging theintermediate backplate under the first predetermined conditioncomprises: heating the intermediate backplate to a first predeterminedtemperature range, wherein within the first predetermined temperaturerange, a viscosity of the unexposed photoresist is smaller than aviscosity of the exposed photoresist; and the first predeterminedtemperature range has a minimum temperature value of 80° C. and amaximum temperature value of 120° C.; and wherein said arranging theintermediate backplate under the second predetermined conditioncomprises: heating the intermediate backplate to a second predeterminedtemperature range, wherein within the second predetermined temperaturerange, the unexposed photoresist is in a solid state to form theplurality of first members, and the exposed photoresist is in a solidstate to form the second member; and the second predeterminedtemperature range has a minimum temperature value of 150° C.
 6. Themethod according to claim 1, wherein said forming the auxiliary layercomprises: forming a plurality of first colloids in the plurality offirst regions, and forming the plurality of first parts by utilizing theplurality of first colloids; and forming a second colloid in the secondregion, and forming the second part by utilizing the second colloid;wherein said arranging the intermediate backplate under the firstpredetermined condition comprises: applying an external force to theintermediate backplate, wherein when applying the external force to theintermediate backplate, a thixotropy of the plurality of first colloidsis greater than a thixotropy of the second colloid; and wherein saidarranging the intermediate backplate under the second predeterminedcondition comprises: stopping applying the external force to theintermediate backplate and letting the intermediate backplate to standin such a manner that the plurality of first colloids is a solid stateto form the plurality of first members and the second colloid is a solidstate to form the second member.
 7. The method according to claim 1,wherein when forming the auxiliary layer, an upper surface of one firstpart of the plurality of first parts away from the backplate is alignedwith an upper surface of the second part away from the backplate; orwherein when forming the auxiliary layer, a distance between thebackplate and an upper surface of one first part of the plurality offirst parts away from the backplate is smaller than a distance betweenthe backplate and an upper surface of the second part away from thebackplate.
 8. A display panel, comprising: a backplate; a eutecticbonding layer and an auxiliary layer that are located at a side of thebackplate, the auxiliary layer comprising a plurality of first membersand a second member, at least one first member of the plurality of firstmembers surrounding one part of the eutectic bonding layer, and thesecond member surrounding the plurality of first members; and aplurality of light-emitting element bodies, each of the plurality oflight-emitting element bodies being located at a side of the eutecticbonding layer, and being connected to one part of the eutectic bondinglayer, wherein a thickness of the eutectic bonding layer in a directionperpendicular to a plane of the backplate is greater than a maximumthickness of each of the plurality of first members in the directionperpendicular to the plane of the backplate, and the thickness of theeutectic bonding layer is also greater than a maximum thickness of thesecond member in the direction perpendicular to the plane of thebackplate.
 9. The display panel according to claim 8, wherein a maximumdistance 11 between the backplate and an upper surface of one firstmember of the plurality of first members away from the backplate and amaximum distance 12 between the backplate and an upper surface of thesecond member away from the backplate satisfy 11≠12.
 10. The displaypanel according to claim 9, wherein one of the plurality of firstmembers comprises a surrounding portion and an overflow portion, whereinthe surrounding portion surrounds a part of the eutectic bonding layer,the second member surrounds the surrounding portion, the overflowportion and the surrounding portion are communicated with each other,and the overflow portion is located at a side of the second member awayfrom the backplate.
 11. The display panel according to claim 9, whereinone first member of the plurality of first members surrounds one part ofthe eutectic bonding layer, the second member surrounds the firstmember, and 11<12; or wherein the second member comprises a plurality ofhollows corresponding the plurality of light-emitting element bodies inone-to-one correspondence; and wherein at least a part of one firstmember of the plurality of first members is located in one of theplurality of hollows, and at least one part of the eutectic bondinglayer connected to one light-emitting element body of the plurality oflight-emitting element bodies is located in one hollow of the pluralityof hollows corresponding to the one light-emitting element body.
 12. Thedisplay panel according to claim 8, wherein the second member comprisesa plurality of hollows, and the plurality of hollows corresponds to aplurality of parts of the eutectic bonding layer in one-to-onecorrespondence; and wherein at least a part of one first member of theplurality of first members is located in one of the plurality ofhollows, and one part of the plurality of parts of the eutectic bondinglayer is located in one hollow of the plurality of hollows correspondingto the one part.
 13. The display panel according to claim 8, wherein thesecond member comprises a plurality of hollows, wherein at least a partof one first member of the plurality of first members is located in oneof the plurality of hollows, and wherein one of the plurality of hollowshas a rectangle shape, a rounded rectangle shape, a circle shape, or anoval shape.
 14. The display panel according to claim 8, wherein athickness of the eutectic bonding layer in the direction perpendicularto the plane of the backplate is greater than a thickness of the secondmember in the direction perpendicular to the plane of the backplate. 15.The display panel according to claim 8, wherein the backplate comprisesa backplate electrode, wherein the eutectic bonding layer is locatedbetween the backplate electrode and one of the plurality oflight-emitting element bodies, and the backplate electrode is in contactwith the eutectic bonding layer; and wherein a thickness of the secondmember in the direction perpendicular to the backplate is greater than athickness of the backplate electrode in the direction perpendicular tothe plane of the backplate.
 16. The display panel according to claim 8,wherein under a first predetermined condition, a fluidity of a materialof the plurality of first members is greater than a fluidity of amaterial of the second member.
 17. The display panel according to claim8, wherein one of the plurality of first members is made of an acrylicadhesive, a non conductive paste (NCP), a non conductive film (NCF) oran unexposed photoresist, and the second member is made of an exposedphotoresist.
 18. The display panel according to claim 8, wherein theauxiliary layer further comprises a plurality of third members, and eachof the plurality of third members surrounds one first member of theplurality of first members and is located between the one first memberand the second member, and wherein under a first predeterminedcondition, a fluidity of a material of the plurality of third members issmaller than a fluidity of a material of the plurality of first members,and is greater than a fluidity of a material of the second member.
 19. Adisplay apparatus, comprising a display panel, wherein the display panelcomprises: a backplate; a eutectic bonding layer and an auxiliary layerthat are located at a side of the backplate, the auxiliary layercomprising a plurality of first members and a second member, at leastone first member of the plurality of first members surrounding one partof the eutectic bonding layer, and the second member surrounding theplurality of first members; and a plurality of light-emitting elementbodies, each of the plurality of light-emitting element bodies beinglocated at a side of the eutectic bonding layer, and being connected toone part of the eutectic bonding layer, wherein a thickness of theeutectic bonding layer in a direction perpendicular to a plane of thebackplate is greater than a maximum thickness of each of the pluralityof first members in the direction perpendicular to the plane of thebackplate, and the thickness of the eutectic bonding layer is alsogreater than a maximum thickness of the second member in the directionperpendicular to the plane of the backplate.